Hot tin dipping, also known as solder dip, tin plating and spin tinning, is one of numerous services offered by American Micro Industries.
The hot tin dip process makes ferrous and non-ferrous materials more resistant to corrosion and wear.
Hot tin dipping extends the life of the material by protecting it from oxidation. The process generally creates a coating of 0.1 to 0.3 mils (0.0001 to 0.0003 inch) thick.
We offer traditional 60/40 Tin / Lead (Sn/Pb) dipping. This type of dipping yields a matte finish for your non-EU and sanctioned EU applications. These exemptions include military and medical device products.
American Micro Industries is able to provide dipping to comply with military specifications. Call 1-866-765-9191 for more information.
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American Micro Industries complies with all of the military, federal and ASTM specifications listed below. Call us if you have any questions.
Though the materials in the following chart are not all inclusive regarding our hot tin dip capabilities, they are the ones with which we have the most experience.
Some materials such as brass require an electro-less nickel under plate prior to hot tin dipping. This under plate prevents the zinc migration of the base metal from contaminating the plated surface.
Additionally, we offer electro plating of various Tin / Lead (Sn/Pb) concentrations for your specific plating requirements.
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